Hytel Group has added an additional Panasonic SMT line as well as two additional
ICT test heads into its Beijing PRItronics facility, a wholly-US-owned joint
venture. New products in the telecom and security products areas have provided
signficant growth in 2006.
Hytel in space
Hytel Group has
manufactured circuits for aerospace applications for over 10 years, but recent
products are going the limit of explored universe. Assembled in Hytel-Hampshire
using copper on ceramic substrates manufactured in Hytel-Elgin, these circuits
are now on their way to Pluto.
Hytel Group names new Quality
Jeff Baker has been named Quality Manager in Hampshire after serving as a Sr.
Staff Engineer in Hytel Group's Elgin facility. Jeff has over 25 years
experience in the electronics industry, including GTE Communication Systems and
AGCS, an ATT-GTE Joint Venture. Jeff has MS and BS engineering degrees from the
University of Illinois.
Hytel Group Acquires the Assets of
Hytel Group has acquired the assets of CirQon Technologies and
established a production facility in Elgin, IL for the manufacture of
photodefined copper on ceramic substrates to be used in aerospace, wireless,
power, and optoelectronics industries. The new facility includes a class 10,000
clean room and zero-discharge plating operations.
Hytel Group included in 2002
Technology Fast 50
Hytel Group was named to the Greater Chicagoland Technology Fast 50
for the third year in a row by Deloitte and Touche. The award is given to
technology companies to recognize outstanding growth over a five year period,
based on audited financial statements submitted.
Hytel Achieves Profits in 2001
Hytel Group was started in 1992, every year has seen an increase in total
revenues, with CAGR of about 50%. 2001 was a difficult year in that many
customers experienced dramatic drops in demand. Total revenues, however,
increased over 2000, and the company was profitable for the year. While 2002
forecasts are still undefined, the outlook remains good due to the combination
of new technology and expected recoveries from current customers.
October, 2001 update
Hytel Group #20 in 2001 Technology
Hytel Group was named to the Greater Chicagoland Technology Fast 50 for the
second year in a row by Deloitte and Touche. The award is given to technology
companies to recognize outstanding growth over a five year period, based on
audited financial statements submitted.
Hytel Group added another line for flip chip assembly in the Hampshire, IL
facility, as well as 2 additional ICT test heads. Orders have been placed for
additional dispensing and bare die placement equipment in late Q2.
Hytel Group makes Chicagoland
Delloitt and Touche Technology Fast 50 list.
Hytel Group was one of 50
companies in the midwest region honored for its high growth rate over the past 3
years. Hytel was #20 on the list (right behind Tellabs at #19), and was the
highest ranked contract electronics manufacturer.
Group achieved a new shipping record month in March, including a new product for
a new customer involved in communications infrastructure who needed 80,000 units
in one month with only 2 week lead time for ramp-up. Using Hytel Group's Total
Team Quality System, a customer-focused team delivered learning curve
improvements on a daily basis, increasing output by 100% in a two week interval
while meeting all customer quality requirements. Success on this initial program
has led to additional volume opportunities with this customer.
Group has ordered a third Micron II Direct Chip Attach System, two additional
automatic wire bonders, CBT6000s from Palomar Systems, and two MPM UP2000
printers. This provides increases in capacity for precision placement of die
from wafer, waffle-pack, tape and reel, bumps up or down, as well as constant
bond loop wire bonding featuring Continuous Bonding Technology. These
capabilities are important for high frequency applications where intereconnect
parasitics can seriously impact performance. Application-specific questions can
be directed to Scott Johansen or
500% 5-year growth- again!
Another year of strong growth in 1999 allowed Hytel Group to maintain its 5 year
growth streak above 500% for the fourth consecutive year. Hytel Group continues
to hire Engineering and Program Managers to ensure customer satisfaction scores
are maintained in the midst of this growth, as well as develop all employees in
its Total Team Quality system.
Capacity Expansions An additional
ESEC Micron 2 has been installed. Additional Asymtek dispenser (Millenium)
Hytel Group exhibits at APEX '99
Hytel Group exhibited at the inaugural APEX conference in Long Beach the third
week of March. APEX is co-sponsored by IPC and SMTA.
Flip Chip Capability Expansions
Hytel Group has installed an ESEC Micron II Direct Chip Attach System, as
well as acquiring additional Asymtek dispensing systems. The Micron II has
capability for picking die from wafer, tray, or tape, flipping, fluxing, and
placing with accuracies to 15 microns. The Millenium has vision and closed-loop
controls to ensure accurate and precise dispensing of underfills and
encapsulants. These systems further enable Hytel Group to offer volume assembly
capability for flip chip/direct chip attach assemblies, with placement
accuracies to 15 microns.