Chip on Board Technology offers excellent value for high miniaturization circuitry. The vast majority of ICs in the world are wire bonded to lead frames today, but advanced packaging techniques which eliminate this extraneous middle step are gaining popularity as the availability of Known Good Die broadens. The ability to increase circuit density, fitting entire subassemblies into the space of a packaged component, as well as eliminating leadtime for additional packaging steps, has driven numerous market-leading firms to utilize wire bonding. Greater power handling and better signal integrity are also available by using bare die directly on either organic or ceramic substrates.
      Hytel Group has extensive experience with wire bonding of both Silicon and Gallium Arsenide. We tend to use gold wire for its superior reliability, and have experience with various encapsulation and lidding techniques. Our in-house thermal shock and Temperature Humidity Bias chambers allows us to assess the reliability of various die, substrate, and assembly material systems.