Thick film ceramic and plated ceramic substrates offer excellent value for high performance/high miniaturization circuitry. They are used extensively by market leaders in wireless, automotive, medical, broadband communications, and test instrumentation electronics. The material properties of alumina make for very stable, reliable circuits, and the ability to integrate passive components into the substrate (capacitors, resistors, inductors) allows for high density, high performance assemblies that operate at high temperatures (above 150C), high frequencies (up to 40Ghz), very small size (up to 3000 I/O/square inch density), and in high volume (millions of circuits per month). Ceramic offers heat dissapation to 100W/sq.in and the ability to stabilize sensitive electronic components.

Hytel Group has extensive experience helping customers apply ceramic technology to their applications. Due to the custom nature of thick film, the technology is most cost effective (often equal or lower in cost to PCB assemblies) at medium to higher volumes (thousands of units and up.)

Hytel Group has experience with numerous ceramic materials and metallizations, as well as full automation throughout the operation. Hytel Group offers foundry services for substrates as well as assembly and test services as well.

Hytel Group also offers photoimaged copper on alumina substrates that offer the same precise trace definition as thin film, albeit at a lower cost in many cases. More information on QClad photodefined copper on ceramic substrates can be found by clicking HERE.