Manufacturing of Reliable Electronics
FDA GMP compliant, Automotive PPAP, Quick-Turn
Prototype and Production, In-circuit, AOI, and Functional Electrical Test,
Globally Competitive, and Customer Driven Manufacturing of Box Build and
Subassemblies. Lead-Free and RoHS-compliance ready. Choose someone you
can trust- Hytel Group.
Design and Manufacturing Services for Miniaturized Modules
for Communications, Industrial, Medical, and Automotive applications using SMT,
COB, and advanced substrates. Take your products where competitors cannot
Surface Mount Assembly
Fine Pitch to .016", chips to 0201, lead-free, semi-aqueous clean and
no-clean chemistries, flip chip down to 180 micron pitch, double-sided, mixed
technology. Explore the latest in technology to compete in the global
markets of today!
Chip on Board and Few
Chip Module Assemblies
Automated die attach of Silicon and GaAs IC's,
gold and aluminum wire, flip chip, encapsulation, underfill, epoxy, and solder
attach. Benefit from the experience and expertise that sets us apart.
Substrate Fabrication, High Density Interconnect, Low Cost Film Substrates
Full cassette to cassette automated processing, featuring through-holes,
multilayers, controlled lines for microwave, copper-plated ceramic for
high-power/high frequency, precision laser trimming, down to .003" (.1mm)
features on Al203, BeO, and AlN, and low cost flex film substrates...
Give your product the competitive advantage it needs in today's global
and program support
Box-build, design services, mechanical assembly,
environmental testing, milling, conformal coating, tape and reel packaging,
turnkey materials management.. Tired of having to negotiate competitive
pricing every step of the way? Go with a proven source- Hytel Group