Metallized Ceramic  Substrates:

-         Copper Plated Ceramic Substrates

-         Precision Laser Trimming to .1%

-         Filled Vias

-         Multilayer, Double-sided

-         LTCC

Low Cost Flex Film Substrates:

-         Copper, Silver Metallizations

-         Directly wire bondable or solderable

Component Assembly:

-         High speed chip shooters

-         0201 assembly

-         BGA, CSP assembly to .020” pitch

-         Flip Chip Assembly down to 150 micron pitch

-         Wave Solder

-         Paste-in-hole

Die Assembly:

-         Epoxy Dispense

-         Die Attach

-         Pick from Wafer

-         Pick from Waffle Pack

-         Eutectic Die Attach

-         Precision Placement

-         Automated Dispensing

Electrical Testing

-         High Frequency Testing to 20 GHz

-         Automated In-Circuit Testing

-         High Pot Testing

-         Environmental Testing

Other

-         BGA Bumping

-         Automated Pin Insertion

-         Plastic Assembly

-         Bar Coding

-         Final Pack

-         Wire Assembly

-         Shielded Assemblies

-         Chinese JV

Turnkey Project and Materials Management

-         Layout and Design Services

-         Sourcing and Materials Qualification

-         Full featured MRP System

-         RosettaNet Compliant e-Business Capabilities

Manufacturing Environment

-         ISO9002 Registered Quality System

-         Class 0 ESD System

-         Class 10,000 Clean Workstations

-         Illinois Team Excellence Winner